Terahertz Microstrip Elevated Stack Antenna Technology on GaN-on-Low Resistivity Silicon Substrates for TMIC

In this paper we demonstrate a THz microstrip stack antenna on GaN-on-low resistivity silicon substrates (ρ < 40 Ω.cm). To reduce losses caused by the substrate and to enhance performance of the integrated antenna at THz frequencies, the driven patch is shielded by silicon nitride and gold in addition to a layer of benzocyclobutene (BCB). A second circular patch is elevated in air using gold posts, making this design a stack configuration. The demonstrated antenna shows a measured resonance frequency in agreement with the modeling at 0.27 THz and a measured S11 as low as −18 dB was obtained. A directivity, gain and radiation efficiency of 8.3 dB, 3.4 dB, and 32% respectively was exhibited from the 3D EM model. To the authors' knowledge, this is the first demonstrated THz integrated microstrip stack antenna for TMIC (THz Monolithic Integrated Circuits) technology; the developed technology is suitable for high performance III-V material on low resistivity/high dielectric substrates

Low-Loss MMICs Viable Transmission Media for GaN-on-Low Resistivity Silicon Technology

In this work a novel ultra-low loss transmission media for RF GaN-on-low-resistivity silicon (LR-Si) substrates (σ < 40 $\Omega$.cm) has been successfully demonstrated. The developed shielded-microstrip lines achieve comparable performance to those on semi-insulating (SI) GaAs substrates with transmission loss of 0.9 dB/mm for frequencies up to 67 GHz. Line performance was further enhanced by additional elevation of the shielded-microstrip lines using air-bridge technology above a 5 μm layer of benzocyclobutene (BCB) on shielded metalized ground planes. Transmission loss of 0.6 dB/mm for frequencies up to 67 GHz was obtained as a result of the extra elevation. Structure parameters were designed and optimized based on EM simulation for best performance. The work shows that the RF energy coupled into the substrate was eliminated, indicating the suitability of III-V-on-LR Si technology for millimeter-wave applications.This work was supported by the EPSRC under grant EP/N014820/1 and III-V national center pump-priming scheme

90 GHz branch-line coupler on GaN-on-low resistivity silicon for MMIC technology

We demonstrate a quadrature branch-line coupler operating at 90 GHz on GaN-on-low resistivity silicon substrates (ρ <; 40 Ω.cm). To reduce the losses offered by the low-resistivity silicon at 90 GHz, a shielding technique is used where the silicon substrate is covered by a ground plane (Al metal). SiO 2 dielectric of thickness 10 μm is used as a spacer between the top metal and ground plane to further improve the performance of the coupler. Measured results showed return loss and isolation as low as -25 dB and -16 dB respectively, and coupling loss of -4 ± 0.5 dB from 81 GHz to 101 GHz. The output amplitude imbalance achieved was less than 1 dB. The coupler validates the shielding MMIC technology on GaN-on-low resistivity silicon substrate